-High bond strength to surfaces 

-Excellent wet-out and high thermal performance 

Typical Application Includes:

-Where need mount heat sink onto BGA graphic/drive processor   

-LED Lighting

Configurations:

-Sheet form/roll form/die-cut parts

Available Thickness:

-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm

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